Paras Semiconductors Partners with US Firm BroadPak to Develop Advanced Chip Packaging Capabilities in India

Announced on 6 November 2026, the partnership brings together Paras Semiconductors’ ambitions in semiconductor manufacturing, optoelectronics and photonics with BroadPak’s expertise in advanced packaging design, heterogeneous integration and semiconductor manufacturing processes.

The collaboration aims to establish an advanced Outsourced Semiconductor Assembly and Test (OSAT) facility in India, capable of supporting specialised semiconductor packaging requirements for artificial intelligence, high-performance computing, data centres, networking and strategic electronics.

The initiative marks another step in Paras Defence’s diversification into advanced technology manufacturing, complementing its established capabilities in defence electronics, optics, optronics and aerospace systems.

Advanced Semiconductor Packaging Facility Planned in India

Under the partnership, Paras Semiconductors intends to develop an advanced heterogeneous integration and 3D semiconductor packaging facility incorporating technologies used in next-generation computing systems.

Unlike conventional semiconductor packaging, which primarily provides electrical connections and physical protection for individual chips, advanced packaging technologies enable multiple semiconductor components to be integrated within a single package.

These components can include processors, memory devices, specialised accelerators and communication interfaces, allowing manufacturers to develop computing systems with improved performance, connectivity and power efficiency.

The proposed facility will focus on 2.5D and 3D integration, chiplet assembly, hybrid bonding, wafer-level processing and panel-level fan-out packaging. It will also develop capabilities in advanced semiconductor testing, reliability qualification and system-level integration.

The project is intended to support high-volume commercial semiconductor applications alongside specialised devices required for defence, aerospace and other strategic industries.

Technology Transfer and Manufacturing Expertise from BroadPak

A central component of the partnership involves technology transfer and access to BroadPak Corporation’s semiconductor packaging expertise.

Headquartered in San Jose, California, BroadPak specialises in advanced packaging architecture, heterogeneous integration, multi-die semiconductor systems and high-speed electronic interconnections.

Founded in 2007, the company has developed expertise across semiconductor packaging design, simulation, manufacturing processes, assembly, testing and production engineering.

Under the collaboration, Paras Semiconductors will gain access to relevant BroadPak intellectual property, process knowledge and engineering expertise for developing advanced packaging technologies in India.

The partnership will also explore the joint development of semiconductor packaging platforms for artificial intelligence and high-performance computing applications.

Training and skill development for Indian engineers form another component of the agreement, supporting the creation of domestic expertise in sophisticated semiconductor assembly, integration and testing processes.

Developing 2.5D and 3D Semiconductor Integration Technologies

One of the principal objectives of the collaboration is to develop capabilities in 2.5D and 3D semiconductor packaging, technologies that are becoming increasingly important in modern computing systems.

In 2.5D packaging, multiple semiconductor dies are placed alongside one another and connected through an advanced interposer or similar high-density interconnection structure. This enables faster communication between processors, memory devices and other components while reducing the distance electrical signals must travel.

Three-dimensional packaging extends this concept by stacking semiconductor dies vertically, allowing more computing components to be integrated within a smaller physical area.

These approaches are particularly valuable in artificial intelligence processors and high-performance computing systems, where increasing processing requirements place considerable demands on memory bandwidth, power consumption and thermal management.

The proposed Indian facility will also develop capabilities involving through-silicon vias, micro-bumping, redistribution layers and hybrid bonding. These technologies enable dense electrical connections between semiconductor components and support the manufacture of highly integrated computing packages.

By establishing these capabilities domestically, Paras Semiconductors aims to participate in an increasingly important segment of the global semiconductor manufacturing industry.

Chiplet Integration to Support Next-Generation Computing

Chiplet technology represents another important focus of the Paras–BroadPak collaboration.

Traditional semiconductor designs frequently integrate numerous functions into a single large silicon die. Chiplet architectures instead divide these functions into smaller semiconductor components that can be manufactured separately and subsequently combined through advanced packaging technologies.

This approach enables manufacturers to integrate processing units, memory controllers, specialised accelerators and communication components using different manufacturing technologies.

Chiplets can also improve design flexibility by allowing semiconductor developers to combine existing functional components rather than redesigning an entire processor for every application.

For artificial intelligence and high-performance computing, such architectures offer opportunities to improve processing efficiency, memory connectivity and overall system performance.

The partnership is intended to help Paras Semiconductors develop the engineering and manufacturing capabilities required to assemble and test these increasingly complex semiconductor systems.

Co-Packaged Optics for AI and Data Centre Applications

The proposed manufacturing capabilities will also extend to co-packaged optics, an emerging technology designed to improve high-speed data communication within advanced computing infrastructure.

Conventional computing systems rely heavily on electrical connections to transfer information between processors, memory devices and networking equipment. As data transmission requirements increase, electrical interconnections face growing challenges involving power consumption, signal integrity and thermal management.

Co-packaged optics integrates optical communication components close to semiconductor processing or switching devices, reducing the distance over which high-speed electrical signals must travel.

This technology has growing relevance for artificial intelligence data centres, high-performance computing systems and next-generation networking equipment, where large volumes of information must be transferred rapidly and efficiently.

Paras Defence’s existing expertise in optics and optronics provides a technological foundation for expanding into semiconductor applications involving photonic integration and optical communication.

The collaboration with BroadPak is intended to connect these existing capabilities with advanced semiconductor packaging and system integration technologies.

₹6,200 Crore Semiconductor Manufacturing Project in Madhya Pradesh

The new technology partnership also complements Paras Semiconductors’ previously announced plans to establish a semiconductor manufacturing facility in Madhya Pradesh.

In July 2026, Paras Semiconductors signed a Memorandum of Understanding with the Government of Madhya Pradesh for a proposed ₹6,200 crore semiconductor facility.

The project is planned for the Ujjain–Indore industrial corridor and is intended to establish advanced semiconductor assembly, packaging and testing infrastructure.

According to details subsequently shared by the company’s management, the proposed investment is expected to be implemented over approximately six years, with construction targeted to begin in the first quarter of 2027 and commercial production planned for the fourth quarter of 2028.

The initial manufacturing capacity is envisaged at approximately 10,000 wafers per month, with plans for phased expansion to more than 50,000 wafers per month over the following years.

The proposed investment represents an important industrial expansion for Paras Semiconductors as it prepares to enter the semiconductor packaging and assembly market.

The BroadPak partnership is expected to provide specialised technology and manufacturing expertise relevant to developing the advanced packaging capabilities envisaged under the company’s broader semiconductor manufacturing plans.

Paras Defence Expands Beyond Traditional Defence Electronics

For Paras Defence & Space Technologies, the collaboration represents a strategic expansion from its established defence and aerospace engineering businesses into advanced semiconductor manufacturing.

The company has developed capabilities in optics, optronics, defence electronics, electromagnetic technologies and specialised engineering systems used in military and aerospace applications.

Semiconductor packaging provides an opportunity to extend these capabilities into technologies that are increasingly important for defence electronics, communications systems, advanced sensors and computing infrastructure.

Munjal Sharad Shah, Managing Director of Paras Defence & Space Technologies, described the company’s semiconductor initiative as an expansion into a technology sector critical to India’s artificial intelligence, data centre and industrial capabilities.

He indicated that advanced packaging would complement the company’s existing strengths in optics, optronics and critical electronics while enabling it to address domestic strategic requirements and wider commercial semiconductor markets.

Santosh Kumar, Chief Executive Officer of Paras Semiconductors, highlighted the industry’s transition towards integrating multiple semiconductor dies, memory devices and processing components within advanced packages.

The company intends to develop manufacturing capabilities that can address the increasing performance, connectivity and thermal requirements of next-generation semiconductor applications.

Strengthening India’s Semiconductor Manufacturing Ecosystem

The partnership comes as India continues to develop domestic capabilities across the semiconductor value chain, including chip design, wafer fabrication, assembly, packaging and testing.

While semiconductor fabrication receives considerable attention because of its technological complexity, advanced packaging has become equally important in enabling the performance of modern computing systems.

Artificial intelligence accelerators, graphics processors and high-bandwidth memory systems increasingly depend on sophisticated packaging technologies to connect multiple semiconductor components.

Developing these capabilities within India would strengthen the country’s participation in a strategically important segment of global electronics manufacturing.

The proposed facility could also support the development of specialised semiconductor devices for optical sensors, advanced communications equipment, aerospace electronics and other high-technology applications.

India’s semiconductor industry has traditionally demonstrated strong capabilities in chip design and engineering services. Investments in advanced assembly, packaging and testing infrastructure are intended to complement these strengths by expanding the country’s participation in physical semiconductor manufacturing.

The collaboration also creates opportunities for developing specialised engineering skills in packaging design, semiconductor materials, thermal management and high-density interconnection technologies.

Building India’s Next Generation of Semiconductor Manufacturing Capabilities

The partnership between Paras Semiconductors and BroadPak Corporation represents an important addition to India’s growing semiconductor manufacturing initiatives.

By combining Indian manufacturing ambitions with specialised American technology expertise, the collaboration aims to establish domestic capabilities in advanced chip packaging, heterogeneous integration and next-generation computing technologies.

The proposed facility will address applications extending from strategic electronics and optical systems to artificial intelligence processors, high-performance computing and data centre infrastructure.

Its emphasis on technology transfer, indigenous engineering capabilities and high-volume manufacturing aligns with India’s wider efforts to strengthen domestic electronics production and technological self-reliance.

With the proposed ₹6,200 crore semiconductor project in Madhya Pradesh providing a broader manufacturing framework, the BroadPak collaboration adds an important technological dimension to Paras Semiconductors’ expansion plans.

The initiative reflects the increasing participation of Indian defence technology companies in advanced semiconductor manufacturing and the development of sophisticated industrial capabilities that can support both national strategic requirements and emerging global technology markets.

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