Indian Infrastructures and Capabilities
Steel production generates large quantities of slag as a by-product, and India already produces millions of tonnes of this material every year. The volume is expected to rise sharply as national steelmaking capacity expands, which makes the question of how to use slag productively increasingly important.
The collaboration will place Kelington’s semiconductor infrastructure expertise inside one of India’s most important technology projects. Tata Electronics is developing the Dholera facility as a 300-mm, or 12-inch, wafer fabrication plant with a planned investment of around $11 billion.
BARC has already identified Tarapur in Maharashtra as the site for the lead BSMR-200 demonstration unit. The project is intended to validate the reactor design, construction methodology, operating systems, safety architecture and economics before any wider commercial rollout is considered.
The wider TVS industrial ecosystem has extensive capabilities in manufacturing, electronics, sensors, automotive components and engineering products. This provides SibSensor with access to an Indian partner that already operates across multiple industrial sectors and has established relationships with domestic customers and manufacturers.
Micron formally opened the Sanand facility on 28 February 2026. The plant receives advanced DRAM and NAND wafers produced elsewhere in Micron’s global manufacturing network and converts them into finished memory and storage products through assembly and testing operations.
India’s nuclear programme was designed around a fundamental resource imbalance. The country possesses relatively modest uranium resources but very large reserves of thorium-bearing minerals, particularly monazite associated with coastal mineral sands.
The announcements reflected India’s transition from building initial semiconductor manufacturing capacity towards developing a complete ecosystem capable of supporting chip production, innovation and commercial deployment.
After completion of the refurbishment activities, Kaiga Unit-1 entered the restart preparation phase with the loading of the first new fuel bundles into the newly installed channels on 13 September 2026.
Electronics and Information Technology Minister Ashwini Vaishnaw outlined the proposal during SEMICON India 2026, saying that the institute would be built around a five-level skilling model. The government wants the training framework to extend beyond conventional chip design and include systems engineering, precision manufacturing, semiconductor production and equipment-related skills.
LightSpeed Photonics has said that the initial facility will support its own research and development requirements before potentially expanding towards commercial-scale production.
