Odisha to Host India’s First 3D Glass Chip Packaging Plant

In a major boost to India’s semiconductor ambitions, Odisha is set to establish the country’s first 3D glass-based chip packaging facility in Bhubaneswar. The project marks a significant step toward strengthening India’s position in advanced electronics manufacturing.

The plant, being developed by US-based 3D Glass Solutions, involves an investment of around ₹1,943 crore and will be located at Info Valley. The foundation stone for the facility was recently laid by Chief Minister Mohan Charan Majhi, in the presence of Union IT Minister Ashwini Vaishnaw.

This cutting-edge unit will introduce advanced 3D heterogeneous integration (3DHI) technology, a next-generation chip packaging method that enhances performance, efficiency, and miniaturisation. Until now, India largely depended on imports for such high-end packaging technologies.

Once operational, the facility is expected to significantly boost India’s semiconductor ecosystem. It will manufacture tens of millions of packaged chips annually and support critical sectors such as artificial intelligence, 5G, defence systems, and high-performance computing.

The project is also likely to generate over 2,500 direct and indirect jobs, contributing to local economic development while attracting further investments in the high-tech sector.

Experts see this as a transformative move for Odisha, which is rapidly shifting from a traditional minerals-based economy to a hub for advanced technology and electronics manufacturing. The state is already witnessing parallel developments, including another semiconductor fabrication project, reinforcing its growing role in India’s chip ecosystem.

This initiative aligns with India’s broader goal of achieving self-reliance in semiconductor production, reducing dependence on imports, and becoming a key player in the global supply chain.