India’s izmo Microsystems Develops Indigenous 40-GHz RF Semiconductor Package for Defence Systems

India has taken another step towards strengthening its domestic defence-electronics supply chain, with Bengaluru-based izmo Microsystems Pvt. Ltd. developing an indigenous high-frequency semiconductor package capable of supporting radio-frequency devices operating at up to 40 GHz.

The company announced on September 1, 2026 that the new Quad Flat No-Lead, or QFN, package was designed, developed and manufactured in India for a customer producing high-frequency RF modules for defence and secure wireless communication applications. Assembly and electrical validation have been completed, while production shipments have already begun.

The development is significant because semiconductor packaging becomes increasingly complex as operating frequencies rise. At microwave and millimetre-wave frequencies, the package is not merely a protective enclosure around a chip. Its internal geometry, conductive paths, wire bonds and materials can directly influence signal integrity, power transfer and the overall performance of the RF device.

izmo Microsystems says its new package uses an optimised RF architecture designed to reduce parasitic effects that can affect high-frequency performance. One of the key engineering features is the use of wire bonds approximately 0.3 millimetres in length, helping minimise unwanted inductance and signal degradation. The package also incorporates a precision air cavity around the semiconductor die, along with optimised trace geometry and die positioning.

These measures allow the package to support operation at frequencies of up to 40 GHz, placing it within a range relevant to advanced defence and aerospace electronics. Such packaging technologies can potentially support systems used in radar, electronic warfare, secure communications, satellite communications and other high-frequency wireless applications.

It is important to distinguish the achievement from the development of a semiconductor chip itself. izmo Microsystems has not announced an indigenous 40-GHz RF chip. Instead, it has developed the specialised package required to house and electrically connect high-frequency semiconductor devices while preserving their RF performance.

This distinction is important because advanced packaging has become a critical part of modern semiconductor engineering. As devices operate at higher frequencies and greater bandwidths, the package can become an integral part of the electrical design rather than simply a mechanical enclosure.

The development has also progressed beyond the prototype stage. izmo Microsystems has confirmed that assembly and electrical validation have been completed and that production shipments are underway. Establishing a repeatable production process is particularly important for defence and aerospace applications, where manufacturing consistency, reliability and tight tolerances are essential.

The identity of the customer has not been disclosed, although the company has confirmed that the package was developed for a manufacturer of high-frequency RF modules intended for defence and secure wireless communication systems.

The achievement also fits into India’s wider effort to reduce dependence on imported strategic electronics. Modern radars, electronic-warfare suites, communication systems and aerospace platforms depend on a large ecosystem of RF semiconductors, substrates, packages, connectors, microwave components and specialised manufacturing processes.

Even when major defence systems are assembled domestically, dependence on imported lower-level electronic components can continue to create supply-chain vulnerabilities. Building indigenous capability in high-frequency semiconductor packaging therefore strengthens an important layer of India’s defence-electronics ecosystem.

izmo Microsystems, a subsidiary of listed IZMO Limited, specialises in semiconductor packaging, System-in-Package technologies and high-reliability electronics for sectors including defence, aerospace, telecommunications, automotive and industrial systems.

Its new 40-GHz RF package represents a notable step into advanced strategic electronics. By designing the package in India, validating it and moving it into production, the company has demonstrated indigenous capability in a specialised area that could become increasingly important as Indian radar, electronic-warfare and secure communication systems move towards higher frequencies and more sophisticated RF architectures.