India’s semiconductor ambitions are often associated with large fabrication plants. However, semiconductor independence begins much earlier than fabrication. Chips must first be architected, designed, verified and prepared for manufacturing.
Hyderabad-based MosChip Technologies is building capabilities across this critical design layer of the semiconductor industry. The company provides silicon and product engineering services covering ASICs, system-on-chip designs, embedded systems and advanced digital products.
MosChip works across the semiconductor development cycle. Its capabilities extend from architecture and RTL design to physical implementation, packaging coordination, testing and post-silicon validation. This allows an electronic product to move from an initial chip concept towards production-ready silicon.
From Chip Design to Working Silicon
MosChip follows a fabless semiconductor model. Instead of operating its own large semiconductor fabrication plant, it focuses heavily on chip engineering. Manufacturing can then be carried out through specialised semiconductor foundries.
This model is common across the global semiconductor industry. It allows design companies to concentrate resources on architecture, intellectual property and engineering.
MosChip’s silicon engineering portfolio includes:
- ASIC and SoC architecture
- RTL design and functional verification
- Analog and mixed-signal design
- Design-for-test or DFT engineering
- Synthesis and physical design
- IP integration
- GDSII implementation and sign-off
- Foundry coordination
- Semiconductor packaging and assembly coordination
- Automated test equipment development
- Prototype silicon bring-up
- Post-silicon validation
- Qualification and transition towards volume production
Its design teams work across digital, analog and mixed-signal semiconductor technologies. MosChip also supports process nodes ranging from mature technologies to advanced nodes.
This breadth is important because creating a semiconductor requires several specialised engineering teams. Problems discovered late in the design process can make a chip programme expensive to correct.
A company capable of handling several stages under one engineering programme can therefore reduce coordination risks.
Taking Responsibility Beyond the Design File
One of MosChip’s important capabilities is its turnkey ASIC model.
In a conventional engineering contract, different companies may handle chip design, physical implementation, fabrication, packaging and testing. MosChip’s turnkey approach attempts to integrate these activities under a single programme.
The company says it can take projects from RTL through GDSII, fabrication coordination, packaging, post-silicon validation and eventual production. It works with semiconductor foundries and outsourced semiconductor assembly and test companies rather than relying on an in-house fabrication facility.
MosChip is also a TSMC Design Center Alliance partner and lists relationships or engineering alignment with several global foundry ecosystems.
Such capabilities place Indian engineers much closer to the complete semiconductor product-development process.
Experience Across Multiple Semiconductor Markets
MosChip’s engineering work covers chips intended for several industries.
These include:
Automotive electronics: Modern vehicles require processors, controllers, connectivity chips and increasingly complex electronic systems.
Industrial electronics: Factory automation, robotics and intelligent control equipment depend on specialised semiconductor devices.
Consumer electronics: Connected products require increasingly integrated SoCs that combine processing, communications and peripheral functions.
Telecommunications and networking: High-speed interfaces and communications equipment rely heavily on customised silicon.
Edge artificial intelligence: AI processing is gradually moving from large cloud systems into cameras, sensors, drones and other embedded devices.
High-performance computing: Advanced computing platforms require highly complex processors, interfaces and packaging technologies.
MosChip says its experience also extends to satellite systems, energy applications and intelligent connected devices.
The company currently reports more than 1,500 engineers, over 100 global clients and more than 600 silicon tape-outs across its wider engineering operations.
Working on India’s AUM High-Performance Computing Processor
One of MosChip’s strategically important programmes is connected with AUM, an indigenous high-performance computing SoC being developed for India’s next generation of supercomputers.
MosChip states that it is the lead Indian design partner with Socionext for the SoC’s design and implementation.
The processor uses the Arm Neoverse V2 platform, high-bandwidth interfaces, advanced packaging and a 5-nanometre technology node. The programme is associated with C-DAC’s efforts to strengthen India’s domestic high-performance computing capabilities.
Projects of this nature allow Indian semiconductor teams to gain experience with extremely complex chip designs rather than concentrating only on simpler embedded devices.
That engineering knowledge can later support processors for AI, communications, scientific computing and other strategic applications.
VIDYUT: An Indigenous Chip for Smart Energy Meters
MosChip is also developing VIDYUT, a semiconductor platform for smart electricity meters.
The project has received support under the Government of India’s Design Linked Incentive Scheme. It is based on a RISC-V platform and is intended to support polyphase energy measurement applications.
The government reported that MosChip successfully validated important IP blocks on a 180-nanometre test chip. These included a power-management unit, temperature sensor, clock-management unit and LCD panel controller. Packaging for the test device was carried out by the Semiconductor Laboratory at Mohali.
The larger objective is to develop a domestically designed smart-meter semiconductor solution.
India is deploying smart electricity meters on a large scale. Developing Indian chips for such equipment can gradually increase domestic value addition while creating reusable semiconductor intellectual property.
Custom Silicon for ISRO’s Satellite Navigation Programme
MosChip has also demonstrated its engineering capabilities in the space sector.
In January 2026, the company announced that it had delivered a custom SoC to ISRO’s Space Applications Centre for India’s satellite navigation programme.
MosChip handled several important stages of the project. These included DFT architecture and implementation, full-chip physical design, RDL routing, package design, tester-board development and post-silicon validation.
According to the company, packaged silicon was delivered and validated for the next stage of product development.
This project illustrates an important part of semiconductor self-reliance. India does not need only domestic factories. It also needs engineering teams capable of converting specialised national requirements into working silicon.
Building Semiconductor Intellectual Property in India
The long-term value of semiconductor design lies partly in intellectual property.
Each successful chip programme builds expertise in processor architecture, analog circuitry, high-speed interfaces, power management, verification, packaging and testing.
MosChip’s engineering portfolio includes technologies involving USB, Ethernet, serial interfaces, power management, clock management, data converters and other semiconductor building blocks.
Such reusable knowledge can shorten the development cycle for future semiconductor products.
It also helps India move from providing engineering manpower to owning larger parts of the semiconductor development process.
A Complement to India’s Semiconductor Fabs
India is simultaneously developing semiconductor fabs, assembly facilities, packaging operations and chip-design companies.
These parts of the ecosystem reinforce one another.
A fabrication plant requires a steady pipeline of chip designs. Fabless semiconductor companies require reliable manufacturing and packaging partners. Electronics manufacturers require dependable sources of chips.
Companies such as MosChip therefore occupy an important position between electronic-product developers and semiconductor manufacturing facilities.
The Government’s Semicon India Programme carries an outlay of ₹76,000 crore, while the Design Linked Incentive Scheme supports domestic semiconductor design companies, startups and MSMEs.
By July 2025, the government had sanctioned 23 chip-design projects for financial assistance under DLI. Seventy-two startups had also received access to advanced electronic-design automation tools.
The policy objective extends beyond simply manufacturing foreign-designed chips in India. It is also aimed at creating Indian semiconductor products and intellectual property.
From Engineering Services to Semiconductor Products
MosChip’s evolution also reflects a wider transition underway within India’s semiconductor sector.
For decades, India built a large pool of engineers working for global semiconductor companies. That talent gave the country considerable strength in chip design.
The next stage involves turning engineering expertise into Indian-owned semiconductor technologies, complete SoCs and commercially deployable chips.
Projects such as VIDYUT demonstrate this transition.
At the same time, programmes involving ISRO and C-DAC give Indian engineering teams exposure to advanced strategic semiconductor requirements.
MosChip’s combination of silicon engineering, product development, verification, packaging coordination and post-silicon work creates capabilities that can support this transition.
Creating a Deeper Semiconductor Ecosystem
A successful semiconductor industry cannot depend on one company or one fabrication plant.
It requires designers, foundries, packaging companies, testing laboratories, EDA tools, IP developers, equipment manufacturers and skilled engineers.
MosChip contributes primarily to the design and silicon-engineering layer of this ecosystem.
Its ability to work from architecture and RTL through physical design and validated silicon means that more semiconductor development knowledge can remain within India’s technology ecosystem.
The company is also building expertise across both mature and advanced semiconductor nodes. Mature nodes remain essential for automobiles, industrial equipment, energy systems and embedded electronics. Advanced nodes are increasingly important for artificial intelligence and high-performance computing.
Having engineering capability across both areas gives India greater flexibility as its domestic semiconductor market expands.
The Road Ahead
India’s semiconductor success will ultimately be measured by more than the number of fabrication facilities built.
The country must develop chips, own intellectual property and create companies capable of taking products from specification to silicon.
MosChip Technologies represents one part of that emerging architecture.
Its work on ASICs, SoCs, physical design, packaging, validation and post-silicon engineering demonstrates that sophisticated semiconductor development can increasingly be undertaken from India.
Projects such as VIDYUT, the AUM high-performance computing SoC and the custom silicon delivered for ISRO also show how these capabilities can support strategic national programmes.
As fabrication, packaging and semiconductor design capacity expand together, companies such as MosChip can help connect India’s existing engineering strength with its emerging manufacturing base.
The deeper achievement will come when chips are not merely manufactured in India, but are increasingly conceived, architected, designed, validated and productised in India as well.
Sources
- MosChip Technologies — Silicon Engineering Services and Turnkey ASIC documentation.
- MosChip Technologies — Silicon Design Services and company overview.
- MosChip Technologies — ISRO Space Applications Centre custom SoC announcement, January 2026.
- Ministry of Electronics & Information Technology / PIB — Design Linked Incentive Scheme and indigenous SoC programmes.
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